Electronics

 

Chip On Board Epoxy (COB)
The chip-on-board epoxy has excellent thermo-mechanical properties and adhesion strength that provides maximum protection to the components, ICs and bonded wires. Dam and fill epoxy are suitable for encapsulation of bigger components and ICs.

Application:
PCBA (Printed Circuit Board Assembly), sealing and bonding of electronic components and devices.
Product Code
Special Features
Appearance
Cure (˚C/ Time)
Mixed Viscosity
(cP at 25°C)
Shelf Life
(month)
Tg (˚C)

EN453

  • Clear COB good for visual inspection
White paste 2hrs @ 125°C 32,000 6 125

EN458

  • Clear COB good for visual inspection
White paste
1hr @ 120°C or
30 mins @ 150°C
220,000
12
125

EN485

  • Good protection for IC and electronic components
Black paste
2hrs @ 120°C or
1hr @ 150°C
52,050
6
140

EN525

  • Good protection for IC and electronic components
Black paste 1hr @ 120°C or
30mins @ 150°C
30,820 12 152

EN641

  • Good protection for IC and electronic components
Black paste
1hr @ 100°C or
30mins @ 120°C
30,000
9
112

EN690

  • Good weatherability
Black paste
1hr @ 100°C
23,850
6
111
 
  • Excellent UV and heat resistant
  • Sealant for automotive LED and electronic devices
Black viscous liquid
30mins @ 150°C
4,800
6
NA

PT300

  • 2-Part casting epoxy
  • Ideal for casting of components for failure analysis
Clear +
clear yellow liquid
2hrs @ 25°C
1,700
12
80

EN418-2

  • Encapsulation of IC on PCB
  • Low temperature cure
  • Good adhension to glass, FR4, SS and Ultem
  • Low CTE
  • Low BLT
Black 2hrs @ 85°C or 1hr @ 100°C 23,460 6 NA

EN418-12

  • Flowable liquid 
  • Suitable for gab filling applications
Black 2hrs @ 100°C 9,850 6 NA

EN456

  • Heat cure adhensive 
  • Excellent adhension to PCB
  • Good thermal shock properties
  • Long pot life
  • Sealing of electronics components like relays
  • Encapsulation of IC devices
White 2hrs @ 125°C or 1hr @ 150°C 140,000 6 125

EN475-9

  • COB epoxy
  • Encapsulation of IC on PCB and smart card IC
  • Sealing of electronic and eletrical devises 
  • Good temperature performance
  • Execellent adhension to most PCB and electronic components
Black 2hrs @ 110°C or 1hr @ 120°C 1,800 12 100

EN893-2

  • Silicone wire encapsulant
  • Cure rapidly over 100°C and has low volatile during curing
  • No sagging
  • Low temperature stable
  • Low outgassing
  • Soft silicon encapsulant to protect gold wire, sensor, especially for heat sensitive electronic component
Slight Translucent 2hrs @ 100°C  4,300 6

-98

EN893-3

  • Heat curable silocone resin
  • Cure rapidly
  • Low volatile content
  • Shore OO hardness
  • Good adhension to glass
  • High and low temp flexibility 
Slight Translucent 2hrs @ 100°C  3,424 6 -108

EN943-24

  • Silicone encapsulant
  • Semi thixotropic
  • Low impurity ionic content
  • Good adhension to glass, metal, PCB and electronic components sealing
  • Low storage modulus at low temperature
  • Low shore A hardness.
Black 30mins @ 150°C or 2hrs @ 100°C  7,956

 

-102

 

EN943-25

  • Silicone encapsulant
  • Semi thixotropic
  • Good adhension to glass, metal, PCB and electronic components sealing
  • Low modulus
  • Low shore A hardness
Black 30mins @ 150°C 1,734 6 NA

EN100-1

  • 2-Part rapid set adhensive based on epoxy
  • Blush free
  • Hard
  • Tough
  • Good scratch and water resistance
  • Enhance adhesion on wet glass, ceramics, most plastics, metal
  • Fast cure
  • Low stress
Clear to sligh yellowish 2hrs @ 25°C  1,700 12 NA
 
 
SMT Epoxy / Die Attach
The SMT epoxy is designed for high speed dispensing with good green strength to hold components in the bond pads. The viscosity and thixotropy are optimized with no bleeding and tailing.


 
Application:
PCBA (Printed Circuit Board Assembly), sealing and bonding of electronic components and devices.
Product Code
Special Features
Appearance
Cure (˚C/ Time)
Viscosity (cP)
Shelf Life
(month)
Tg (˚C)

CB643

  • High speed dispensing
  • Fast cure with reflow oven
Red paste 90s @ 150°C or
300s @ 115°C 
30,000 * 12 120

CB644

  • High speed dispensing
  • Fast cure with reflow oven
Black paste 5mins @ 150°C,
20mins @120°C or
30mins @ 100°C
5,500,000 ** 6 131

CB648

  • High speed dispensing
  • Fast cure with reflow oven
Red paste 90s @ 150°C or
2hrs @ 80°C 
5,000,000 ** 12

135

CB651

  • High speed dispensing
  • Fast cure with reflow oven
Red paste 5mins @ 150°C,
20mins @ 120°C or
30mins @ 100°C
6,000,000 ** 12

 

124

 

CB603-2

  • High speed dispensing
  • Cure fast at low temperature
  • Excellent adhension to PCB and electronic components 
  • Has relatively low viscosity for every high speed dispense from automated SMT dispending machine
  • General bonding for many plastics, ceramic and mental
Black paste 40mins @ 80°C 42,250 6 120

CB621

  • High speed SMT epoxy
  • Cure fast at low temperature
  • Excellent adhension to PCB and electronic components 
  • Has long pot life, minimal stringing, prevent sagging.
  • Has relatively low viscosity for every high speed dispense from automated SMT dispending machine
Red paste 90sec @ 150°C or  5min @ 120°C or 15min @ 100°C  17,000 6 NA

CB625-3

  • High speed SMT epoxy
  • Cure fast at low temperature
  • Excellent adhension to PCB and electronic components 
  • Has relatively low viscosity for every high speed dispense from automated SMT dispending machine
Red paste  5min @ 150°C or 2hr @ 80°C 

118,533*

4,000,000**

12 101

CB648-2

  • High speed SMT epoxy
  • Fast cure
  • Good adhension to glass, FR4, SS, AI, PC, plasic, ceramic and metals
Red 90s @150°C or  5min @ 150°C 223,300*** 12 101
* Vicosity tested at CAP 2000+ viscometer, 25°C, Cap-06@100rpm
** Vicosity tested at Brookfield RVT, 25°C
 
 
 
Silver Epoxy / Die Attach
The silver die attach has been designed for auto dispensing, stamping and screen printing with excellent adhesion on various substrates such as copper and gold. Besides the electrical conductivity, it has excellent thermal conductivity which makes it suitable for bonding components that generate heat.

Application:
PCBA (Printed Circuit Board Assembly), sealing and bonding of electronic components and devices.
Product Code
Special Features
Appearance
Cure (˚C/ Time)
Viscosity (cP)
Shelf Life (month)

AG803

  • Good adhesion strength
  • High Tg
Silver paste  2hrs @ 120°C,
1hr @ 150°C or
30mins @ 170°C
25,000

12

AG806

  • Good adhesion strength
  • High Tg
Silver paste 2hrs @ 120°C or
1hr @ 150°C
65,000 9

AG830-12

  • Low curing temperature (80-100°C)
  • Low stress
Silver paste 1hr @ 90°C 3,200 3 hours

DA620

  • Good adhesion
  • Good for transparent die attach
  • Good UV and heat resistance
  • Suitable for stamping and dispensing process
Translucent liquid 2hrs @ 120°C or
1hr @ 150°C
7,500 6

DA669

  • Fast cure
  • Low stress
Clear liquid 13mins (Gel time) &
2hrs (Cure Time) @ 120°C or
2mins (Gel time) &
1hr (Cure Time) @ 150°C.
1,000 6

DA669-2

  • Good adhesion
  • Good for transparent die attach
  • Suitable for stamping and dispensing process
Translucent liquid 2hrs @ 120°C or
1hr @ 150°C
7,500 6

DA669-3

  • Suitable for die attach of high performance microelectronic semiconductor and optoelectronic component
  • Excellent performance in temperature cycling, high temperature storage, humidity storage and light output degradation
  • Outdoor weathering performance
  • Good UV resistance
Translucent liquid 2hrs @ 120°C or
1hr @150°C
5,500

6

DA669-4

  • Black jetting COB
  • Suitable for die attach of high performance microelectronic semiconductor
  • Recommand for bonding of electronic, plastic, ceramic and metal
  • Excellent performance in temperature cycling, high temperature storage, humidity storage and light output degradation
  • Outdoor weathering performance
  • Good UV resistance
Black 1hr @ 120°C 6,500

6

 

DA620-1

  • Die attach epoxy
  • Suitable to most electronic part, plastic, ceramic and metal
  • Good performance in temperature cycling, high temperature storage and humidity storage
  • Good UV resistance
White 2hrs @ 120°C or
1hr @ 150°C
5,800 - 7,800 6

AG824

  • Ag conductive epoxy
  • Low viscosity
  • Good adhensive
  • Bonding IC chip to metal bond pad and general electrical connection 
Silver paste 2hrs @ 150°C 7,000 6

AG824-1

  • Ag conductive epoxy
  • Cured and hardened at 150°C
  • Good electrical and thermal conductive properties, controlled 30um BLT
  • Low viscosity
  • Good adhensive
  • Good thermal resistance
  • Bonding IC chip to metal bond pad and general electrical connection. 
Silver paste 2hrs @ 150°C 12,713 6

AG815-1

  • 2-Part conductive potting epoxy 
  • Good scratch and water resistance
  • Enhance adhension on wet glass, ceramic, plastic and metal
  • Good flow, good sea page and min trap of bubbles 
Black  2hrs @ 80°C or 24hrs @ 25°C 15,300 12

AG819-3

  • Flexible Ag ink
  • Low electrical resistance
  • Excellent flexibility and elasticity 
  • Excellent adhension to polymer and ceramic substrate, long working life at RT
  • Stable at high temperature, 250(30min)
  • Suitable for screen print, flexible printed circuits, RFID antennas and membrane switches
Silver paste 10mins @ 110°C or 30mins @ 80°C 6,750 12

AG819-4

  • Flexible Ag ink (PU)
  • Low electrical resistance
  • Execellent flexibility and electricity
  • Execellent adhension to polymer, ceramic and electronic component
  • Long working life at RT
  • Stable at high temperature, 250°C (30min)
  • Suitable for screen print, flexible printed circuits, RFID antennas and membrane switches
Silver paste 10mins @ 110°C or 30mins @ 80°C 7,025 12

AG822

  • Flexible Ag ink
  • Low electrical resistance 
  • Execellent flexibility and electicity
  • Execellent adhension to polymer, ceramic and electronic component
  • Long working life at RT
  • Stable at high temperature, 250°C (30min)
  • Suitable for screen print, flexible printed circuits, RFID antennas and membrane switches
Brown 10mins @ 110°C or 10mins @ 80°C 148,000 12
 
 
Underfill Epoxy
The underfill epoxy is designed with good flow and capillary properties that can fill the area between the die and the carrier. Once cured, it helps to absorb the stress exerted on the solder bumps. It gives strong adhesion and improves the mechanical integrity to ensure long term reliability.

Application:
PCBA (Printed Circuit Board Assembly), sealing and bonding of electronic components and devices.
Product Code
Special Features
Appearance
Cure (˚C/ Time)
Viscosity (cP)
Shelf Life
(month)
Tg (˚C)

UF256

  1. Fast cure
  2. Low CTE
Off white 5mins @150°C or
10mins @130°C
800 6 102
 
 
Epoxy Sealant
The epoxy sealant is ideal for bonding and sealing various types of electronic devices such as relays, transformers and fiber optic components. It can be used to bond different types of substrates such as metal, plastic, glass and composite materials.

Application:
PCBA (Printed Circuit Board Assembly), sealing and bonding of electronic components and devices
Product Code
Special Features
Appearance
Cure (˚C/ Time)
Viscosity (cP)
Shelf Life
(month)
Tg (˚C)

GL172

  1. Fast cure
  2. Low stress
Dark blue liquid 24hrs @ 25°C or
30mins @ 70°C
21,040 6 70

GL174

  1. Fast cure
  2. Low stress
Black paste 24hrs @ 25°C or
3hrs @ 80°C
3,500 3 60

GL440

  1. Good adhesion strength on wide range of substrates
  2. Superior physical and mechanical properties after cured
Clear +
yellowish liquid
15mins (Gel time) &
2hrs (Cure Time) @ 80°C or
 6mins (Gel time) &
1hr (Cure Time) @ 120°C
1,040 12 65

GL506

  1. Good adhesion strength on wide range of substrates
  2. Superior physical and mechanical properties after cured
Clear +
yellowish liquid
24hrs @ 25°C or
2hrs @ 80°C
32,700 12 90

GL614-4

  1. Good structural epoxy with no flow
  2. Low shrinkage during cure
  3. Good adhesion to ultem and PCB
  4. Pass 2000 hours damp heat at 85°C/ 85% RH
  5. Pass 100 cycles thermal shock at -40°C to 85°C
  6. Pass 500 cycles thermal cycling at 85°C, 20°C/min ramp, 10mins soak
White paste 12mins (Gel time) &
2hrs (Cure Time) @ 100°C or
2mins (Gel time) &
30mins (Cure Time) @ 150°C
42,000 6 121

GL616

  1. Good structural epoxy with no flow
  2. Low shrinkage during cure
  3. Good adhesion to ultem and PCB
  4. Pass 2000 hours damp heat at 85°C/ 85% RH
  5. Pass 100 cycles thermal shock at -40°C to 85°C
  6. Pass 500 cycles thermal cycling at 85°C, 20°C/min ramp, 10mins soak
White paste 12mins (Gel time) &
2hrs (Cure Time) @ 100°C or
2mins (Gel time) &
30mins (Cure Time) @ 150°C
24,000 12 122

GL902-4

  • Ideal replacement for gasket
Green 24hrs @ 25°C 7,500 12 NA

GL104-2

  • 2-Part epoxy
  • Good scratch and water resistance
  • Enhance adhension on wets glass, ceramic, plastic and metal
  • Low vicosity to ensure good flow, good sea page to every corner and minimum trapping of bubbles
  • Low stress bonding, potting, encapsulation of electronic components
Slightly yellowish 45mins @ 75°C 5,600 12 46

GL107

  • Food grade epoxy adhensive
  • Excellent adhension to PC boards, electronic components, ceramic, metal and most plastic in electronic
  • Stable pot life
  • High thixotropic
  • BPA Free
  • FDA approval
White paste Precure 60mins @ 100°C, followed by post cure 20mins @ 150°C 37,530 6 122

GL158

  • Electronic epoxy
  • No sagging
  • Stable pot life
  • Excellent adhension to most PC boards and electronic components
  • Low viscosity for faster dispense from syringe
  • High thixotropic
Off white paste 2hrs @ 100°C, or 30mins @ 150°C 35,000 12 156

GL168

  • Electronic epoxy
  • Cure fast at elevated temperature
  • Excellent adhension to most PC boats and electronic component
  • Design for bonding electronic components, low viscosity for faster dispense from syringe
  • High thixotropic to control the flow
Off white paste 2hrs @ 100°C, 2hrs @ 120°C or 30mins @ 150°C 45,000

12

150

GL614

  • Electronic epoxy
  • No sagging
  • Has stable pot life
  • For bonding electronic components
  • Low viscosity for faster dispense from syringe
  • High thixotropic to control the flow
White paste

2hrs @ 100°C or 30mins @ 150°C

24,000 12 122

GL614-8

  • Electronic epoxy
  • Excellent adhension to most PC board and electronic components
  • No sagging
  • Stable pot life
  • High thixotropic
  • Good adhension to PCB, SS, ceramic and metal
Black Pre-cure 60mins 47,000 6 115

GL901-5

  • Blue colour Silicon adhensive
  • Excellent low and high temperature performance
  • Adhension to various substrate (metal, ceramic, plastic, Si rubber) can be improved with CT686-4, Silicon primer
  • High shore A hardness
  • Smooth shiny surface
Blue 30mins @ 150°C 15,700 6 NA

GL904-2

  • 2-Part rapid set reactiveeEpoxy
  • Good scratch and water resistance
  • Enhance adhension on wet glass, ceramic, most plastic and metal
  • Low stress epoxy for electrical and electronic devices
Sligh translucent yellowish 24hrs @ 25°C or 1hr @ 80°C 5,082 12 NA

GL311-1

  • Structural epoxy
  • Good water resistance
  • Enhance adhension
  • Low viscosity
  • For strucural applications, lamination of quality boat

Clear

24hrs @ RT 1,400 12 NA

GL441

  • Heavy epoxy paste 
  • Good water resistance
  • Enhance adhension
  • Specially formulated for potting or encapsulation of electronic devices
  • High viscosity
Beige liquid 24hrs @ RT 24,400 12 NA

GL507

  • Heavy epoxy paste
  • Good water resistance
  • Enhance adhesion
  • Specially formulated for potting or encapsulation of electronic devices
Beige liquid 24hrs @ RT 200,000 12 NA

GL904-2

  • 2-Part rapid reactive epoxy
  • Good scratch and water resistance
  • Enhance adhension on wet glass, ceramic, plastic and metals
Sligh translucent yellowish 24hrs @ 25°C or 1hrs @ 80°C 5,082 12 NA

GL104-2

  • 2-Part epoxy
  • Good scratch and water resistance
  • Enhance adhension on wet glass, ceramic, plastic, metal.
  • Low viscosity to ensure good flow, good seapage to every coner ans minimum trapping of bubbles
  • Low stress bonding, potting and ensapsulation of electronic components
Slightly yellowish 45mins @ 75°C 5,600 12 46

GL107

  • Food grade epoxy adhensive
  • Excellent adhension to PC board, electronic components, ceramic, metal and most plastic in electronic
  • Stable pot life 
  • High thixotropic
  • BPA free
  • FDA approval
White paste Precure 60mins @ 100°C, followed by post cure 20mins @ 150°C 37,530 6 122

GL158

  • Electronic epoxy
  • No sagging
  • Stable pot life
  • Excellent adhension to most PC boards electronic components
  • Low viscosity for faster dispense from syringe
  • High thixotropic
Off white paste 2hrs @ 100°C or 30mins @ 150°C 35,000 12 156

GL168

  • Electronic epoxy
  • Cure fast at elevated temperature
  • Excellent adhension to most PC boats and electronic component
  • Design for bonding electronic components
  • Low viscosity for faster dispense from syringe
  • High thixotropic to control the flow 
Off white paste 2hrs @ 100hrs, 2hrs @ 120°C or 30mins @ 150°C 45,000 12 150

GL614

  • Electronic epoxy
  • No sagging
  • Stable pot life
  • For bonding electronic component
  • Low viscosity for faster dispense from syringe
  • High thixotropic control flow
White paste 2hrs @ 100°C or 30mins @ 150°C 24,000 12 122

GL614-8

  • Electronic epoxy
  • Excellent adhesion to most PC board and electronic components
  • No sagging
  • Stable pot life
  • High thixotropic
  • Good adhesion to PCB, SS, ceramic and metal
Black Pre-cure 60mins 47,000 6 115

GL901-5

  • Blue color Silicon adhesive
  • Excellent low and high temperature performance
  • Adhesion to various substrate (metal, ceramic, plastic, Si rubber) can be improved with CT686-4, Silicon primer
  • High Shore A hardness
  • Smooth shiny surface
Blue 30mins @ 150°C 15,700 6 NA

GL904-2

  • 2-Part rapid set Reactive Epoxy
  • Good scratch
  • Water resistance
  • Enhance adhesion and wets glass, ceramic, most plastic and metal
  • Low stress epoxy for electrical and electronic devices
Slight translucent yellowish 24hrs @ 25°C or 1hr @ 80°C 5,082 12 NA

GL311-1

  • Structural epoxy
  • Good water resistance
  • Enhance adhesion
  • Low viscosity
  • Wet the glass fiber network
  • For structural applications and lamination of quality boat
Clear 24hrs @ RT 1,400 12 NA

GL441

  • Heavy epoxy paste
  • Good water resistance
  • Enhance adhesion
  • Specially formulated for potting or encapsulation of electronic devices
  • High viscosity
Beige white 24hrs @ RT 24,400 12 NA

GL507

  • Heavy Epoxy Paste
  • Good water resistance
  • Enhance adhesion
  • Specially formulated for potting and encapsulation of electronic devices
Beige white 24hrs @ RT 200,000 12 NA

GL904-2

  • 2-Part rapid reactive epoxy
  • Good scratch
  • Water resistance
  • Enhance adhesion and wet glass, ceramics, plastic and metals
Slight translucent yellowish 24hrs @ 25°C or 1hr @ 80°C 5,082 12 NA
 
 
Epoxy Potting / Silicone Potting
The potting epoxy and silicone are designed with excellent thermal and mechanical properties that provide maximum protection on the electronic components and devices under critical operation conditions. The viscosity has been optimized with good flow properties for filling up gaps between components.

Application:
PCBA (Printed Circuit Board Assembly), sealing and bonding of electronic components and devices.
Product Code
Special Features
Appearance
Cure (˚C/ Time)
Viscosity (cP)
Shelf Life
(month)
Tg (˚C)

PT366

  • Good Flowability
  • Good weatherability
  • Excellent protection for electronic devices
Black +
clear liquid
6hrs (Gel time) &
24hrs (Cure Time) @ 25°C or
30mins (Gel time) &
2hrs (Cure Time) @ 80°C
3,863 12 63

PT369

  • Good Flowability
  • Optically clear and transparent
Clear liquid 4hrs (Gel time) &
24hrs (Cure Time) @ 25°C or
30mins (Gel time) &
2hrs (Cure Time) @ 80°C or
15mins (Gel time) &
1hr (Cure Time) @ 100°C
17,800 12 71

PT380-1

  • Good Flowability
  • Good weatherability
  • Excellent protection for electronic devices
White liquid 24hrs @ 25°C or
3hrs @ 80°C
1,720 12 NA

PT497

  • Good Flowability
  • Optically clear and transparent
Clear liquid 24hrs @ 25°C or
3hrs @ 80°C
860 12 95

PT605

  • Good Flowability
  • Good weatherability
  • Low stress
Black + yellowish clear liquid 24hrs @ 25°C or
3hrs @ 80°C
32,000 12 NA

PT910-4

 
  • Good Flowability
  • Good weatherability
  • High heat resistance
Black liquid 24hrs @ 25°C
7.500
12
NA

PT542

  • Optoelectronic Epoxy
  • Encapsulation of high performance optoelectronic devices, LED chip and components
  • Bonding of electronic part, plastic and ceramic
  • Excellent performance in temperature cycling, high temperature and humidity storage, minimal light output degradation
  • Outdoor weathering
  • Maximum resistance to yellowing from oxidation, high temperature degradation and sunlight
  • Good crack resistance from thermos-mecanical stress
Blue liquid

Precure 60mins @ 120°C-125°C 

Post cure: 120mins @ 125°C-135°C

3,200 12 24

PT605

  • 2-Part Flexible black potting epoxy
  • Good scratch and water resistance
  • Enhanced adhesion
  • Low viscosity
  • Suitable for wet glass, ceramic, most plastic and metal
Black 24hrs @ 25°C or 3hrs @ 80°C 1,700 12 NA

PT605-3

  • 2-Part flexible black potting epoxy
  • Good scratch and water resistance
  • Enhance adhesion, low viscosity
  • Suitable for wet glass, ceramic, plastic and metal
Black 24hrs @ 25°C or 4hrs @ 50°C  1,700 12 NA

PT605-6

  • Flexible translucent potting epoxy
  • Good scratch and water resistance
  • Enhance adhesion
  • Low viscosity
  • Suitable for wet glass, ceramic, most plastic and metal
Transcucent liquid 24hrs @ 25°C, 4hrs @ 50°C or 3hrs @ 80°C 970 6 -28°C

PT605-9

  • Flexible black potting epoxy
  • Good scratch and water resistance
  • Enhance adhesion to ultem and metal
  • Low viscosity to ensure good flow, good seepage into corners and minimum trapping of bubble
  • For low stress potting/backfill/ encapsulation of electronic component
  • Soft shore A hardness
Black 1.5hrs @ 135°C 970 6 -28°C

PT609-3

  • 2-Part flame retardant encapsulant epoxy
  • Good scratch and water resistance
  • Enhance adhesion on wet glass, ceramic, most plastic and metal
  • Prevent excessive flow during application
  • Epoxy encapsulant or dam material for electrical and electronic devices
White 48hrs @ 25°C or 2hrs @ 80°C 10,464 12 45

PT610

  • 2 part flame retardant potting epoxy
  • Low viscosity
  • Good scratch and water resistance.
  • Enhance adhesion on wet glass, ceramics, plastics and metals
  • Good flow, good seepage to every corner,
  • Room temperature cure
  • Vertical flame rating UL94-V0.
  • Potting/back-fill epoxy for electrical and electronic devices
Black liqud 24hrs @ 25°C or 1hr @ 80°C 286,564 12 54

PT910-10

  • Silicone potting
  • 2 part addition cure liquid silicon rubber
  • Good optical transparency and low shrinkage
  • Low hardness
  • Provide low stress for excellent performances in temperature cycling, high temperature storage, high humidity storage and outdoor weathering
  • Solventless, no by-product
  • Flexible
  • Used for potting/encapsulation for LED device or other electronic components
Clear Transparent 24hrs @ 25°C or 30mins @ 120°C 4,600 12 NA

PT917-1

  • 2-part addition cure silicone
  • Provide solid  flexible silicon rubber with low hardness
  • Good high temperature performance and low thermal mechanical shrinkage
  • Used as moldmaking material
  • For reproduce intricate and high quality replicas
Ligth Blue 24hrs @ 25°C or 2hrs @ 80°C 15,450 12 NA

PT917-2

  • 2 part mold-making silicon
  • Good high temperature performance
  • Low thermal mechanical shrinkage
  • Medium hardness
  • Provide low stress for excellent performance in temperature cycling, high temperature storage, high humidity storage and outdoor weathering
  • Good in mechanical strength
  • Fast cure
Translucent 24hrs @ 25°C or 2hrs @ 80°C 4,200 12 NA

PT917-3

  • 2 part mold-making silicon
  • Good temperature performance
  • Low thermal mechanical shrinkage
  • Medium hardness
  • Low stress for excellent performance in temperature cycling, high temperature storage, high humidity storage and outdoor weathering
  • Good mechanical strength
  • Fast cure
Light blue 24hrs @ 25°C or 2hrs @ 80°C 4,200 12 NA

PT1002

  • Rigid system for surface mount encapsulation of LED chip in OPTO devices
  • Excellent environmental protection, become lens portion of devices and displays excellent clarity and light transmissivity
  • Available in several transparent/diffused color in addition to standard clear
  • Excellent material for high temperature casting of discretes
Blue Liqud Pre cure, 2hrs @ 135°C or 8hrs @ 150-160°C  360-8115 18 130
 
 
UV Epoxy / Silicone
The UV epoxy is suitable to bond fiber optic components, electronic components, LCD panels and other type of substrates such as plastic, Ultem and metals.

The UV curable silicone is specially designed for COB process in the manufacturing of LED. It is more economical compare to the conventional molding process. Besides the high UPH, it gives all the excellent properties that required in high power LED.

Application:
PCBA (Printed Circuit Board Assembly), sealing and bonding of electronic components and devices.
Product Code
Special Features
Appearance
Cure
Viscosity (cP)
Shelf Life
(month)

UV200

  • Excellent flexibility
  • Good toughness
  • Low cure shrinkage
  • Good adhesion to a variety of substrates
Yellowish transparent liquid 320 - 400 nm, 420mW/cm2 for 10s 245 6

UV255

  • Coating on flexible substrates
Light grey liquid 20s @ UV 60mW/cm2 or 10mins @ 150°C 3,500 6

UV367

  • Housing of electronic components for tape and reel
Clear liquid 3s @ UV 1000mW/cm2 740 12

UV379-1

  • Bonding of plastic parts to PCB/MCPCB
Translucent liquid 5s @ 400mW/cm2 UV Intensity 17,500 6

UV566-14

  • Excellent thermal-physical stability
  • Bonding for highly sensitive devices such as optical communication devices
White translucent paste 3s @ UV 1000mW/cm2 or
5 seconds at UV 500mW/cm2 or
15s @ UV 200mW/cm2 +
30mins @ 120°C
12,000 6

UV566-25

  • Medium viscosity
  • Heat cure epoxy system
  • Good toughness
  • Good adhesion to metals, glass
  • Not inhibited by oxygen during UV cure
Translucent white

Pre-cure: 2W/cm2, 15s (365nm)

Post cure: 1-1.5hrs @100-130°C
13,760 6

UV788-2

  • UV curable epoxy system
  • Structural adhesive
  • High flow rate
  • Good adhesion to metal, plastics and glass
  • Not inhibited by oxygen during UV cure.
  • Low CTE
  • Flowable
  • Pass PCT test 48 hr without delamination
  • Pass MSL 85C/85% RH 2000 hr
Translucent white

Precure: 365nm: 15sec, 2000mW/cm2

 Postcure: 1hr @100°C or above.

22,800*or

51,590**
6

UV767-2

  • UV-Vis curable acrylate
  • Good toughness
  • Good adhesion to various substrate including glass, metal and plastics
  • Stable at room temperature
  • Pass MSL 85C/85%RH 1000 hr without delamination
Translucent yellowish

(365nm):2000mW/cm2, 3-15s

(380-500nm): 500mW/cm2 or above, 10s

(320-380nm): 300mW/cm2, 3s

(Sunlight): 30s

7,600 12
** Viscosity CP25-1, 10s-1 at 25C
 
Acrylic Conformal Coat
The conformal coat provides excellent moisture and environmental protection. It is a one-component, solvent-based, air-dried coating system. It has a fluorescent agent for easy inspection under UV light. It is recommended for coating and protection of electronic parts, most plastics, ceramics and metals.

Application:
PCBA (Printed Circuit Board Assembly), sealing, coating and bonding of electronic components and devices.
Product Code
Special Features
Appearance
Cure
Viscosity (cP)
Shelf Life
(month)
Fluorescent
Agent

CT682

  • Fast drying
  • Good adhesion
Clear liquid 16hrs @ 25°C or
30mins @ 80°C
320 12 Yes

CT684

  • Fast drying
  • Good adhension
Clear liquid 16hrs @ 25°C or
30mins @ 80°C
320 12 No

CT986-4

  • Solvent based silicone primer
  • Used as surface treating agent for bonding potting cured silicone rubber with plastic material such as PC, nylon and metal substrate
  • Blue color indicator for inspection
Blue Liquid (Silanes) 10-30mins dry RT <30 6 Blue color

CT682-1

  • Solvant based acrylic conformal coating 
  • Air dried coating system
  • Coating and protection of electronic components, PCBA, most plastics, ceramic and metals
  • Excellent moisture and environmental protection
  • Water resistance
  • Easy inspection under UV light
Clear liquid 16hrs @ 25C or 30mins @ 80C 65 12 Yes

CT682-2

  • Solvent based flame retardant conformal coating
  • Air-dried coating system
  • Excellent moisture and environmental protection
  • Coating and protection of electronic parts, most plastic, ceramic and metal
Translucent liquid 16hrs @ 25°C or 30mins @ 80°C 385 12 Yes

CT985-5

  • Heat cure silicone conformal coating
  • Good self-levelling
  • Long pot life.
  • Provide very good high temperature performance
  • Good flexibility
  • Low thermal mechanical shrinkage
  • Low moisture absorption
  • an be used for conformal coating for PCB, sensor and junction coating for semiconductor
Translucent liquid 5mins @ 130°C, 60mins @ 150°C (less surface tackiness) 2,980 6 No