Electronics
![]() The chip-on-board epoxy has excellent thermo-mechanical properties and adhesion strength that provides maximum protection to the components, ICs and bonded wires. Dam and fill epoxy is suitable for encapsulation of bigger components and ICs. Application: PCBA (Printed Circuit Board Assembly), sealing and bonding of electronic components and devices |
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Product Code
|
Special Features
|
Appearance
|
Cure (˚C/ Time)
|
Mixed Viscosity
(cP at 25°C) |
Shelf Life
(month) |
Tg (˚C)
|
|
White paste
|
2 hours at 125°C
|
32,000
|
6
|
125
|
|
|
White paste
|
1 hour at 120°C or 30 minutes at 150°C |
220,000
|
12
|
125
|
|
|
Black paste
|
2 hours at 120°C or
1 hour at 150°C |
52,050
|
6
|
140
|
|
|
Black paste
|
1 hour at 120°C or
30 minutes at 150°C |
30,820
|
12
|
152
|
|
|
Black paste
|
1 hour at 100°C or 30 minutes at 120°C |
30,000
|
9
|
112
|
|
|
Black paste
|
1 hour at 100°C
|
23,850
|
6
|
111
|
|
|
Black viscous liquid
|
30 minutes at 150°C
|
4,800
|
6
|
NA
|
|
|
Clear +
clear yellow liquid |
2 hour at 25°C
|
1,700
|
12
|
80
|
![]() The SMT epoxy is designed for high speed dispensing with good green strength to hold components in the bond pads. The viscosity and thixotropy are optimized with no bleeding and tailing. Application: PCBA (Printed Circuit Board Assembly), sealing and bonding of electronic components and devices |
||||||
Product Code
|
Special Features
|
Appearance
|
Cure (˚C/ Time)
|
Viscosity (cP)
|
Shelf Life
(month) |
Tg (˚C)
|
|
Red paste
|
90 seconds at 150°C or
300 seconds at 115°C |
30,000 *
|
12
|
120
|
|
|
Black paste
|
5 minutes at 150°C or
20 minutes at 120°C or 30 minutes at 100°C |
5,500,000 **
|
6
|
131
|
|
|
Red paste
|
90 seconds at 150°C or
2 hours at 80°C |
5,000,000 **
|
12
|
135
|
|
|
Red paste
|
5 minutes at 150°C or
20 minutes at 120°C or 30 minutes at 100°C |
6,000,000 **
|
12
|
124
|
* Vicosity tested at CAP 2000+ viscometer, 25°C ,Cap-06@100rpm ** Vicosity tested at Brookfield RVT, 25°C |
![]() The silver die attach has been designed for auto dispensing, stamping and screen printing with excellent adhesion on various substrates such as copper and gold. Besides the electrical conductivity, it has excellent thermal conductivity which makes it suitable for bonding components that generate heat. Application: PCBA (Printed Circuit Board Assembly), sealing and bonding of electronic components and devices |
|||||
Product Code
|
Special Features
|
Appearance
|
Cure (˚C/ Time)
|
Viscosity (cP)
|
Shelf Life (month)
|
|
Silver paste
|
2 hours at 120°C or
1 hour at 150°C or 30 minutes at 170°C |
25,000
|
12
|
|
|
Silver paste
|
2 hours at 120°C or
1 hour at 150°C |
65,000
|
9
|
|
|
Silver paste
|
1 hour at 90°C
|
3,200
|
3 hour
|
|
![]() |
|
Translucent liquid | 2 hours at 120°C or 1 hour at 150°C |
7,500 | 6 |
|
Clear liquid
|
13 minutes (Gel time) &
2 hours (Cure Time) at 120°C or 2 minutes (Gel time) & 1 hours (Cure Time) at 150°C. |
1,000
|
6
|
|
|
Translucent liquid | 2 hours at 120°C or 1 hour at 150°C |
7,500
|
6
|
![]() The underfill epoxy is designed with good flow and capillary properties that can fill the area between the die and the carrier. Once cured, it helps to absorb the stress exerted on the solder bumps. It gives strong adhesion and improves the mechanical integrity to ensure long term reliability. Application: PCBA (Printed Circuit Board Assembly), sealing and bonding of electronic components and devices |
||||||
Product Code
|
Special Features
|
Appearance
|
Cure (˚C/ Time)
|
Viscosity (cP)
|
Shelf Life
(month) |
Tg (˚C)
|
|
Off white
|
5 minutes at 150°C or
10 minutes at 130°C |
800
|
6
|
102
|
![]() The epoxy sealant is ideal for bonding and sealing various types of electronic devices such as relays, transformers and fiber optic components. It can be used to bond different types of substrates such as metal, plastic, glass and composite materials. Application: PCBA (Printed Circuit Board Assembly), sealing and bonding of electronic components and devices |
||||||
Product Code
|
Special Features
|
Appearance
|
Cure (˚C/ Time)
|
Viscosity (cP)
|
Shelf Life
(month) |
Tg (˚C)
|
|
Dark blue liquid
|
24 hours at 25°C or
30 minutes at 70°C |
21,040
|
12
|
70
|
|
|
Black paste
|
24 hours at 25°C or
3 hours at 80°C |
3,500
|
3
|
60
|
|
|
Clear +
yellowish liquid
|
15 minutes (Gel time) &
2 hours (Cure Time) at 80°C or 6 minutes (Gel time) & 1 hours (Cure Time) at 120°C |
1,040
|
12
|
65
|
|
|
Clear +
yellowish liquid
|
24 hours at 25°C or
2 hours at 80°C |
32,700
|
12
|
90
|
|
|
White paste | 12 minutes (Gel time) & 2 hours (Cure Time) at 100°C or 2 minutes (Gel time) & 30 minutes (Cure Time) at 150°C |
42,000
|
6
|
121
|
|
|
White paste |
12 minutes (Gel time) &
2 hours (Cure Time) at 100°C or 2 minutes (Gel time) & 30 minutes (Cure Time) at 150°C |
24,000
|
12 |
122
|
|
|
Green
|
24 hours at 25°C
|
7,500
|
12
|
NA
|
![]() The potting epoxy and silicone are designed with excellent thermal and mechanical properties that provide maximum protection on the electronic components and devices under critical operation conditions. The viscosity has been optimized with good flow properties for filling up gaps between components. Application: PCBA (Printed Circuit Board Assembly), sealing and bonding of electronic components and devices |
||||||
Product Code
|
Special Features
|
Appearance
|
Cure (˚C/ Time)
|
Viscosity (cP)
|
Shelf Life
(month) |
Tg (˚C)
|
|
Black +
clear liquid
|
6 hours (Gel time) &
24 hours (Cure Time) at 25°C or 30 minutes (Gel time) & 2 hours (Cure Time) at 80°C |
3,863
|
12
|
63
|
|
|
Clear liquid
|
4 hours (Gel time) &
24 hours (Cure Time) at 25°C or 30 minutes (Gel time) & 2 hours (Cure Time) at 80°C or 15 minutes (Gel time) & 1 hour (Cure Time) at 100°C |
17,800
|
12
|
71
|
|
|
White liquid
|
24 hours at 25°C or
3 hours at 80°C |
1,720
|
12
|
NA
|
|
|
Clear liquid
|
24 hours at 25°C or
3 hours at 80°C |
860
|
12
|
95
|
|
|
Black + yellowish clear liquid
|
24 hours at 25°C or
3 hours at 80°C |
32,000
|
12
|
NA
|
|
|
Black liquid
|
24 hours at 25°C
|
7,500
|
12
|
NA
|
![]() The UV epoxy is suitable to bond fiber optic components, electronic components, LCD panels and other type of substrates such as plastic, Ultem and metals. The UV curable silicone is specially designed for COB process in the manufacturing of LED. It is more economical compare to the conventional molding process. Besides the high UPH, it gives all the excellent properties that required in high power LED. Application: PCBA (Printed Circuit Board Assembly), sealing and bonding of electronic components and devices
|
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Product Code
|
Special Features
|
Appearance
|
Cure
|
Viscosity (cP)
|
Shelf Life
(month) |
![]() |
|
Yellowish transpatent liquid |
320 - 400 nm, 420mW/cm2 for 10 seconds | 245 |
6
|
|
Light grey liquid
|
20 seconds at UV 60mW/cm2 or 10 minutes at 150°C
|
3,500
|
6
|
|
|
Clear liquid
|
3 seconds at UV 1000mW/cm2
|
740
|
12
|
|
|
Translucent liquid
|
5 seconds at 400mW/cm2 UV Intensity
|
17,500
|
6
|
|
|
White translucent paste
|
3 seconds at UV 1000mW/cm2 or
5 seconds at UV 500mW/cm2 or 15 seconds at UV 200mW/cm2 + 30 minutes at 120°C |
12,000
|
6
|
![]() The conformal coat provides excellent moisture and environmental protection. It is a one-component, solvent-based, air-dried coating system. It has a fluorescent agent for easy inspection under UV light. It is recommended for coating and protection of electronic parts, most plastics, ceramics and metals. Application: PCBA (Printed Circuit Board Assembly), sealing, coating and bonding of electronic components and devices |
||||||
Product Code
|
Special Features
|
Appearance
|
Cure
|
Viscosity (cP)
|
Shelf Life
(month) |
Fluorescent
Agent |
|
Clear liquid
|
16 hours at 25°C
30 minutes at 80°C |
320
|
12
|
Yes
|
|
|
Clear liquid
|
16 hours at 25°C
30 minutes at 80°C |
320
|
12
|
No
|