Electronics

 

Chip On Board Epoxy (COB)
The chip-on-board epoxy has excellent thermo-mechanical properties and adhesion strength that provides maximum protection to the components, ICs and bonded wires. Dam and fill epoxy is suitable for encapsulation of bigger components and ICs.

Application:
PCBA (Printed Circuit Board Assembly), sealing and bonding of electronic components and devices
Product Code
Special Features
Appearance
Cure (˚C/ Time)
Mixed Viscosity
(cP at 25°C)
Shelf Life
(month)
Tg (˚C)
  1. Clear COB good for visual inspection
White paste
2 hours at 125°C
32,000
6
125
    EN458
  1. Clear COB good for visual inspection
White paste
 1 hour at 120°C or
30 minutes at 150°C
220,000
12
125
  1. Good protection for IC and electronic components
Black paste
2 hours at 120°C or
1 hour at 150°C
52,050
6
140
  1. Good protection for IC and electronic components
Black paste
1 hour at 120°C or
30 minutes at 150°C
30,820
12
152
  1. Good protection for IC and electronic components
Black paste
 1 hour at 100°C or
30 minutes at 120°C
30,000
9
112
  1. Good weatherability
Black paste
1 hour at 100°C
23,850
6
111
  1. Excellent UV and Heat resistant
  2. Sealant for automotive LED and electronic devices
Black viscous liquid
30 minutes at 150°C
4,800
6
NA
  1. 2-Part casting epoxy
  2. Ideal for casting of components for Failure Analysis
Clear +
clear yellow liquid
2 hour at 25°C
1,700
12
80
 
 
 
SMT Epoxy / Die Attach
The SMT epoxy is designed for high speed dispensing with good green strength to hold components in the bond pads. The viscosity and thixotropy are optimized with no bleeding and tailing.

Application:
PCBA (Printed Circuit Board Assembly), sealing and bonding of electronic components and devices
Product Code
Special Features
Appearance
Cure (˚C/ Time)
Viscosity (cP)
Shelf Life
(month)
Tg (˚C)
  1. High speed dispensing
  2. Fast cure with reflow oven
Red paste
90 seconds at 150°C or
300 seconds at 115°C 
30,000 *
12
120
  1. High speed dispensing
  2. Fast cure with reflow oven
Black paste
5 minutes at 150°C or
20 minutes at 120°C or
30 minutes at 100°C
5,500,000 **
6
131
  1. High speed dispensing
  2. Fast cure with reflow oven
Red paste
90 seconds at 150°C or
2 hours at 80°C 
5,000,000 **
12
135
  1. High speed dispensing
  2. Fast cure with reflow oven
Red paste
5 minutes at 150°C or
20 minutes at 120°C or
30 minutes at 100°C
6,000,000 **
12
124
* Vicosity tested at CAP 2000+ viscometer, 25°C ,Cap-06@100rpm
** Vicosity tested at Brookfield RVT, 25°C
 
 
 
Silver Epoxy / Die Attach
The silver die attach has been designed for auto dispensing, stamping and screen printing with excellent adhesion on various substrates such as copper and gold. Besides the electrical conductivity, it has excellent thermal conductivity which makes it suitable for bonding components that generate heat.

Application:
PCBA (Printed Circuit Board Assembly), sealing and bonding of electronic components and devices
Product Code
Special Features
Appearance
Cure (˚C/ Time)
Viscosity (cP)
Shelf Life (month)
  1. Good adhesion strength
  2. High Tg
Silver paste
2 hours at 120°C or
1 hour at 150°C or
30 minutes at 170°C
25,000
12
  1. Good adhesion strength
  2. High Tg
Silver paste
2 hours at 120°C or
1 hour at 150°C
65,000
9
  1. Low curing temperature (80-100°C)
  2. Low stress
Silver paste
1 hour at 90°C
3,200
3 hour
   DA620
  • Good adhesion
  • Good for transparent die attached.
  • Good UV and Heat Resistance
  • Suitable for stamping and dispensing process
 Translucent liquid 2 hours at 120°C or
1 hour at 150°C		 7,500 6
  1. Fast cure
  2. Low stress
Clear liquid
13 minutes (Gel time) &
2 hours (Cure Time) at 120°C or
2 minutes (Gel time) &
1 hours (Cure Time) at 150°C.
1,000
6
  • Good adhesion
  • Good for transparent die attached.
  • Suitable for stamping and dispensing process
 Translucent liquid 2 hours at 120°C or
1 hour at 150°C
7,500
6
 
 
 
Underfill Epoxy
The underfill epoxy is designed with good flow and capillary properties that can fill the area between the die and the carrier. Once cured, it helps to absorb the stress exerted on the solder bumps. It gives strong adhesion and improves the mechanical integrity to ensure long term reliability.

Application:
PCBA (Printed Circuit Board Assembly), sealing and bonding of electronic components and devices
Product Code
Special Features
Appearance
Cure (˚C/ Time)
Viscosity (cP)
Shelf Life
(month)
Tg (˚C)
  1. Fast cure
  2. Low CTE
Off white
5 minutes at 150°C or
10 minutes at 130°C
800
6
102
 
 
 
Epoxy Sealant
The epoxy sealant is ideal for bonding and sealing various types of electronic devices such as relays, transformers and fiber optic components. It can be used to bond different types of substrates such as metal, plastic, glass and composite materials.

Application:
PCBA (Printed Circuit Board Assembly), sealing and bonding of electronic components and devices
Product Code
Special Features
Appearance
Cure (˚C/ Time)
Viscosity (cP)
Shelf Life
(month)
Tg (˚C)
  1. Fast cure
  2. Low stress
Dark blue liquid
24 hours at 25°C or
30 minutes at 70°C
21,040
12
70
  1. Fast cure
  2. Low stress
Black paste
24 hours at 25°C or
3 hours at 80°C
3,500
3
60
  1. Good adhesion strength on wide range of substrates
  2. Superior physical and mechanical properties after cured
Clear +
yellowish liquid
15 minutes (Gel time) &
2 hours (Cure Time) at 80°C or
6 minutes (Gel time) &
1 hours (Cure Time) at 120°C
1,040
12
65
  1. Good adhesion strength on wide range of substrates
  2. Superior physical and mechanical properties after cured
Clear +
yellowish liquid
24 hours at 25°C or
2 hours at 80°C
32,700
12
90
  1. Good structural epoxy with no flow
  2. Low shrinkage during cure
  3. Good adhesion to ultem and PCB
  4. Pass 2000 hours damp heat at 85°C/ 85% RH
  5. Pass 100 cycles thermal shock at -40°C to 85°C
  6. Pass 500 cycles thermal cycling at 85°C, 20°C/min ramp, 10mins soak
 White paste 12 minutes (Gel time) &
2 hours (Cure Time) at 100°C or
2 minutes (Gel time) &
30 minutes (Cure Time) at 150°C
42,000
6
121
  1. Good structural epoxy with no flow
  2. Low shrinkage during cure
  3. Good adhesion to ultem and PCB
  4. Pass 2000 hours damp heat at 85°C/ 85% RH
  5. Pass 100 cycles thermal shock at -40°C to 85°C
  6. Pass 500 cycles thermal cycling at 85°C, 20°C/min ramp, 10mins soak
 White paste
12 minutes (Gel time) &
2 hours (Cure Time) at 100°C or
2 minutes (Gel time) &
30 minutes (Cure Time) at 150°C
24,000
 12
122
  1. Ideal replacement for gasket
Green
24 hours at 25°C
7,500
12
NA
 
 
 
Epoxy Potting / Silicone Potting
The potting epoxy and silicone are designed with excellent thermal and mechanical properties that provide maximum protection on the electronic components and devices under critical operation conditions. The viscosity has been optimized with good flow properties for filling up gaps between components.

Application:
PCBA (Printed Circuit Board Assembly), sealing and bonding of electronic components and devices
Product Code
Special Features
Appearance
Cure (˚C/ Time)
Viscosity (cP)
Shelf Life
(month)
Tg (˚C)
  1. Good Flowability
  2. Good weatherability
  3. Excellent protection for electronic devices
Black +
clear liquid
6 hours (Gel time) &
24 hours (Cure Time) at 25°C or
30 minutes (Gel time) &
2 hours (Cure Time) at 80°C
3,863
12
63
  1. Good Flowability
  2. Optically clear and transparent
Clear liquid
4 hours (Gel time) &
24 hours (Cure Time) at 25°C or
30 minutes (Gel time) &
2 hours (Cure Time) at 80°C or
15 minutes (Gel time) &
1 hour (Cure Time) at 100°C
17,800
12
71
  1. Good Flowability
  2. Good weatherability
  3. Excellent protection for electronic devices
White liquid
24 hours at 25°C or
3 hours at 80°C
1,720
12
NA
  1. Good Flowability
  2. Optically clear and transparent
Clear liquid
24 hours at 25°C or
3 hours at 80°C
860
12
95
  1. Good Flowability
  2. Good weatherability
  3. Low stress
Black + yellowish clear liquid
24 hours at 25°C or
3 hours at 80°C
32,000
12
NA
  1. Good Flowability
  2. Good weatherability
  3. High heat resistance
Black liquid
24 hours at 25°C
7,500
12
NA
 
 
 
UV Epoxy / Silicone
The UV epoxy is suitable to bond fiber optic components, electronic components, LCD panels and other type of substrates such as plastic, Ultem and metals.

The UV curable silicone is specially designed for COB process in the manufacturing of LED. It is more economical compare to the conventional molding process. Besides the high UPH, it gives all the excellent properties that required in high power LED.

Application:
PCBA (Printed Circuit Board Assembly), sealing and bonding of electronic components and devices
Product Code
Special Features
Appearance
Cure
Viscosity (cP)
Shelf Life
(month)
 UV200
  • Excellent flexibility
  • Good toughness
  • Low cure shrinkage
  • Good adhesion to a variety of substrates

Yellowish transpatent liquid

 320 - 400 nm, 420mW/cm2 for 10 seconds 245
6
  1. Coating on flexible substrates
Light grey liquid
20 seconds at UV 60mW/cm2 or 10 minutes at 150°C
3,500
6
  1. Housing of electronic components for tape and reel
Clear liquid
3 seconds at UV 1000mW/cm2
740
12
  1. Bonding of plastic parts to PCB/MCPCB
Translucent liquid
5 seconds at 400mW/cm2 UV Intensity
17,500
6
  1. Excellent thermal-physical stability
  2. Bonding for highly sensitive devices such as optical communication devices
White translucent paste
3 seconds at UV 1000mW/cm2 or
5 seconds at UV 500mW/cm2 or
15 seconds at UV 200mW/cm2 +
30 minutes at 120°C
12,000
6
 
 
 
Acrylic Conformal Coat
The conformal coat provides excellent moisture and environmental protection. It is a one-component, solvent-based, air-dried coating system. It has a fluorescent agent for easy inspection under UV light. It is recommended for coating and protection of electronic parts, most plastics, ceramics and metals.

Application:
PCBA (Printed Circuit Board Assembly), sealing, coating and bonding of electronic components and devices
Product Code
Special Features
Appearance
Cure
Viscosity (cP)
Shelf Life
(month)
Fluorescent
Agent
  1. Fast drying
  2. Good adhesion
Clear liquid
16 hours at 25°C
30 minutes at 80°C
320
12
Yes
  1. Fast drying
  2. Good adhesion
Clear liquid
16 hours at 25°C
30 minutes at 80°C
320
12
No