Optical Communication

Heat Curable Epoxy
Advanced design of epoxies with good bonding strength and optical matching to allow optimum signal transition is always desired in this industry. The heat curable epoxies for precision alignment and optical components that have adhesion on glass, metal, ceramic and most plastic substrates provide excellent thermal and moisture resistance.

Application:
Sealing fibers into ferrules, bonding optical fibers into connectors or/and ferrules, potting fiber bundles, V-groove array, chip bonding such as fiber media converters and transceiver modules assemblies.
 
Product Code
Special Features
Appearance
Cure (˚C/ Time)
Viscosity
(cP)
Shelf Life
(month)
Tg (˚C)

GL616

  • Good structural epoxy with no flow
  • Low shrinkage during cure
  • Good adhesion to ultem and PCB
  • Pass 2000 hours damp heat at 85°C/ 85% RH
  • Pass 100cycles thermal shock at -40°C to 85°C
  • Pass 500cycles thermal cycling at 85°C, 20°C/min ramp, 10mins soak
White 2hrs @  100°C or
30mins @ 150°C
24,000 12 122

GL168

  • Good structural epoxy with no flow
  • Low shrinkage during cure
  • Good adhesion to ultem and PCB
  • Pass 2000 hours damp heat at 85°C/ 85% RH
  • Pass 1000cycles thermal shock at -40°C to 85°C
  • Pass 1000cycles thermal cycling at 85°C,
    20°C/min ramp, 10mins soak
  • Pass PCT 121°C, 100%RH, 2 atm, 48hrs
  • Bond well with metals, ceramics, glass and PCB
White 2hrs @ 100°C or
30mins @ 150°C
45,000 12 119

GL158

  • Good structural epoxy with no flow
  • Low shrinkage during cure
  • Good adhesion to ultem and PCB.
  • Pass 2000 hours damp heat at 85°C/ 85% RH
  • Pass 1000cycles thermal shock at -40°C to 85°C
  • Pass 1000cycles thermal cycling at 85°C
    20°C/min ramp, 10mins soak
  • Pass PCT 121°C, 100%RH, 2 atm, 48hrs
  • Bond well with metals, ceramics, glass and PCB
White 2hrs @ 100°C or
30mins @ 150°C
35,000 12 119

EN418-2

  • Good structural epoxy with no flow
  • Low shrinkage during cure
  • Low CTE
  • Good adhesion to ultem and PCB.
  • Pass 2000 hours damp heat at 85°C/ 85% RH
  • Pass 1000cycles thermal shock at -40°C to 85°C
  • Pass 1000cycles thermal cycling at 85°C
    20°C/min ramp, 10mins soak
  • Pass PCT 121°C, 100%RH, 2 atm, 48hrs
  • Bond well on gold, nickel, kovar, stainless steel, aluminium PCB, glass and etc
Black

1hr @ 85°C -120°C

21,000 6 136

EN418-TI

  • EN418-2 high Thixotropic version
  • Good structural epoxy with no flow
  • Low shrinkage during cure
  • Low CTE
  • Good adhesion to ultem and PCB.
  • Pass 2000 hours damp heat at 85°C/ 85% RH
  • Pass 1000cycles thermal shock at -40°C to 85°C
  • Pass 1000cycles thermal cycling at 85°C
    20°C/min ramp, 10mins soak
  • Pass PCT 121°C, 100%RH, 2 atm, 48hrs
  • Bond well on gold, nickel, kovar, stainless steel, aluminium PCB, glass and etc
Black

1hr @ 85°C -120°C

83,565 6 130

TH737-1

  • Good structural epoxy with no flow
  • Low shrinkage during cure
  • Good adhesion to Ultem, Aluminium and PCB
  • Pass 2000 hours damp heat at 85°C/ 85% RH
  • Pass 1000cycles thermal shock at -40°C to 85°C
  • Pass 1000cycles thermal cycling at 85°C
    20°C/min ramp, 10mins soak
  • Thermally conductive at 2.6W/mk
  • Bond well on Gold, Nickel, Kovar, Stainless Steel, Aluminium PCB, Glass and etc.
  • Low CTE
  • Pass PCT 121°C, 100%RH, 2 atm, 48hrs
White 30mins @ 95°C 154,870 6 132
 
 
UV Curable Adhesive
Fast cure, high viscosity UV-curable epoxy system. Excellent flexibility, good toughness and good adhesion to a variety of substrates including metals and plastics. It has low odor and low skin and eye irritation potential. It does not contain volatiles and is very suitable for fiber optic applications. It is not inhibited by oxygen during UV cure, has low shrinkage, high gloss and good resistance to yellowing. The thixotropy has been adjusted to control excessive overflow. 

Application:
Sealing OSA hole, fiber ferrules, bonding optical components, connectors or/and ferrules, potting fiber bundles, V-groove array, chip bonding such as fiber media converters and transceiver modules assemblies. 
 
Product Code
Special Features
Appearance
Cure (˚C/ Time)
Viscosity
(cP)
Shelf Life
(month)
Tg (˚C)

UV252

  • Flowable
  • UV light curable
  • Good optical transmittance from 1000nm and above
  • Good adhesion up to 150kgf/cm
  • Pass 1000 hours damp heat at 85°C/ 85% RH
  • Pass 1000cycles thermal shock at -40°C to 85°C
  • Pass 1000cycles thermal cycling at 85°C, 20°C/min ramp, 10mins soak
  • Pass PCT 121°C, 100%RH, 2 atm, 48hrs
  • Suitable for epoxy lens, EMC, ceramic, glass, PC, gold, ultem, nickel, stainless steel and PCB
Translucent light yellow

2000mW/cm3, 15s or

350mW/cm3, 100s

9,710 6 114

UV252-1

  • Slight Flowable
  • UV light curable
  • Room temperature storage
  • Good optical transmittance from 1000nm and above
  • Good adhesion up to 200kgf/cm2
  • Pass 1000 hours damp heat at 85°C/ 85% RH
  • Pass 1000cycles thermal shock at -40°C to 85°C
  • Pass 1000cycles thermal cycling at 85°C, 20°C/min ramp, 10mins soak
  • Pass PCT 121°C, 100%RH, 2 atm, 48hrs
  • Suitable for epoxy lens, EMC, ceramic, glass, PC, gold, ultem, nickel, stainless steel and PCB
Translucent light yellow

365nm

2000mW/cm3, 15s or

500mW/cm3, 3s

 

380-500nm

500mW/ cm3, 20-100s

5,500 5 115

UV252-2

  • Not Flowable
  • UV light curable
  • Low CTE
  • Good optical transmittance from 1000nm and above
  • Good adhesion up to 200kgf/cm2
  • Pass 1000 hours damp heat at 85°C/ 85% RH
  • Pass 1000cycles thermal shock at -40°C to 85°C
  • Pass 1000cycles thermal cycling at 85°C, 20°C/min ramp, 10mins soak
  • Pass PCT 121°C, 100%RH, 2 atm, 24hrs
  • Suitable for epoxy lens, EMC, ceramic, glass, PC, gold, ultem, nickel, stainless steel and PCB
Translucent White

2000mW/cm3, 5s or

300mW/cm3, 100s

26,000 6 106

UV772-5(R2)

  • Flowable
  • UV and visible light curable
  • Flexible
  • Good adhesion, up to 80kgf/cm2
  • Good optical transmittance from 1000nm and above
  • Good adhesion, up to 200kgf
  • Pass 1000 hours damp heat at 85°C/ 85% RH
  • Pass 1000cycles thermal shock at -40°C to 85°C
  • Pass 1000cycles thermal cycling at 85°C, 20°C/min ramp, 10mins soak
  • Suitable for ceramic, PC, glass, ultem, stainless steel and PCB
  • Pass PCT 121°C, 100%RH, 2 atm, 24hrs
Clear Transparent

365nm-500nm

2000mW, 10s

500 6 30

UV768-9

  • Flowable
  • UV light curable
  • Good optical transmittance from 900nm and above
  • Good adhesion, 8kgf/cm2
  • Pass 1000 hours damp heat at 85°C/ 85% RH
  • Pass 1000cycles thermal shock at -40°C to 85°C
  • Pass 1000cycles thermal cycling at 85°C, 20°C/min ramp, 10mins soak
  • Pass PCT 121°C, 100%RH, 2 atm, 24hrs
  • Suitable for ceramic, glass, ultem, nickel, stainless steel and PCB
Clear Transparent

365nm

2000mW, 15s

2,000 6 108

UV257-3

  • Flowable
  • UV light curable
  • Flexible
  • Suitable to use for bonding and active alignment for opaque substrates
  • For Pressure sensitive application and adhesive open time is 5mins
  • Good adhesion, up to 300kgf/cm2
  • Pass 1000 hours damp heat at 85°C/ 85% RH
  • Pass 1000cycles thermal shock at -40°C to 85°C
  • Pass 1000cycles thermal cycling at 85°C, 20°C/min ramp, 10mins soak
  • Suitable for ceramic, PC, glass, ultem, stainless steel and PCB
  • Pass PCT 121°C, 100%RH, 2 atm, 48hrs
Translucent

365nm

1600mW, 3.5s

14,063 6 60

UV257-2

  • Flowable
  • UV light curable
  • Flexible
  • Suitable to use for bonding and active alignment for opaque substrates
  • For pressure sensitive applications and adhesive open time is 1-5mins.
  • Good adhesion up to 300kgf/cm2
  • Pass 1000 hours damp heat at 85°C/ 85% RH
  • Pass 1000cycles thermal shock at -40°C to 85°C
  • Pass 1000cycles thermal cycling at 85°C, 20°C/min ramp, 10mins soak
  • Suitable for ceramic, PC, glass, ultem, stainless steel and PCB.
  • Pass PCT 121°C, 100%RH, 2 atm, 48hrs
Translucent

365nm

2000mW, 7s

Or

400mW, 3s

 

*Accelerate room temperature or heat can increase the adhesion is an optional.

10,800 6 72
 
 
Dual Cure UV Adhensive
Precision alignment UV-curable epoxy system. Excellent range of viscosity selection, toughness and good adhesion to a variety of substrates including metals, PCB and plastics. It has low odour, low outgassing and excellent reliability resistance. It has low outgassing and is very suitable for optic communication applications. It is not inhibited by oxygen during UV cure, has low shrinkage, high gloss and good resistance to yellowing. The thixotropy has been adjusted to control excessive overflow. 

Application:

Sealing fibers into ferrules, bonding optical fibers into connectors or/and ferrules, potting fiber bundles, V-groove array, chip bonding such as fiber media converters and transceiver modules assemblies RI Matching and active alignment applications.

 
Product Code
Special Features
Appearance
Cure (˚C/ Time)
 Viscosity
(cP)
Shelf Life
(month)
Tg (˚C)

UV566-17

  • Non flowable and high thixotropic index
  • Suitable to use for bonding and active alignment applications
  • Good adhesion, up to 220kgf/cm2
  • Pass 1000 hours damp heat at 85°C/ 85% RH
  • Pass 1000cycles thermal shock at -40°C to 85°C
  • Pass 1000cycles thermal cycling at 85°C, 20°C/min ramp, 10mins soak
  • Suitable for ceramic, PC, glass, ultem, stainless steel and PCB
  • Pass PCT 121°C, 100%RH, 2 atm, 48hrs
Translucent liquid

1000mW/cm2, 3s or

500mW/cm2, 6s or

200mW/cm2, 15s
+
120°C/30-120mins

6,000 6 105

UV566-20

  • Non flowable and high thixotropic Index
  • Suitable to use for bonding and active alignment applications
  • Good adhesion up to 200kgf
  • Pass 1000 hours damp heat at 85°C/ 85% RH
  • Pass 1000cycles thermal shock at -40°C to 85°C
  • Pass 1000cycles thermal cycling at 85°C, 20°C/min ramp, 10mins soak
  • Suitable for ceramic, PC, glass, ultem, stainless steel and PCB
  • Pass PCT 121°C, 100%RH, 2 atm, 48hrs

Translucent

liquid

320nm -380nm

1000mW/cm2, 3s or

500mW/cm2, 6s or 200mW/cm2, 15s

 

365nm

2000mW/cm2, 15-25s

+
120-130°C, 30mins

6,500 6 <100

UV566-22

  • Non flowable
  • Suitable to use for bonding and active alignment applications
  • Good adhesion, up to 220kgf/cm2
  • Pass 2000 hours damp heat at 85°C/ 85% RH
  • Pass 1000cycles thermal shock at -40°C to 85°C
  • Pass 1000cycles thermal cycling at 85°C, 20°C/min ramp, 10mins soak
  • Suitable for ceramic, PC, glass, ultem, stainless steel and PCB
  • Pass PCT 121°C, 100%RH, 2 atm, 48hrs
Translucent Liquid

320nm -380nm

1000mW/cm2, 3s or

500mW/cm2, 6s or 200mW/cm2, 15s

 

365nm

2000mW/cm2, 15s

+
120-130°C, 30mins

4,400 6 <100

UV739-1

  • Non flowable
  • Thermally conductive UV adhesive
  • High Tg, Low CTE and thermal resistance UV adhesive
  • BLT <50um
  • Suitable to use for die attach, bonding and active alignment applications
  • Good adhesion, up to 280kgf/cm2
  • Pass 2000 hours damp heat at 85°C/ 85% RH
  • Pass 1000cycles thermal shock at -40°C to 85°C
  • Pass 1000cycles thermal cycling at 85°C, 20°C/min ramp, 10mins soak
  • Suitable for ceramic, PC, glass, ultem, stainless steel and PCB
  • Pass PCT 121°C, 100%RH, 2 atm, 48hrs
Off White

365nm

2000mW/cm2, 30s

500mW/cm2, 60s +
125°C, 60mins

70,500 6 105

UV254

  • Low viscosity and flowable
  • Shadow Curable adhesive with opaque substrates
  • High Tg and thermal resistance
  • Suitable to use for die attach, bonding and active alignment applications
  • Good adhesion up to 420kgf/cm2
  • Pass 2000 hours damp heat at 85°C/ 85% RH
  • Pass 1000cycles thermal shock at -40°C to 85°C
  • Pass 1000cycles thermal cycling at 85°C, 20°C/min ramp, 10mins soak
  • Suitable for ceramic, Kovar, Aluminium, PC, glass, ultem, stainless steel, ultem and PCB
  • Pass PCT 121°C, 100%RH, 2 atm, 48hrs
Translucent White

365nm

2000mW/cm2, 15s +
100°C, 60mins

or

Heat Cure only

100-130°C/2hrs or above

481 6 165

UV254-1

  • Slight Flow <1mm
  • Shadow Curable adhesive with opaque substrates
  • Suitable to use for die attach, bonding and active alignment applications
  • Low CTE
  • Can resist 260C reflow for 30mins
  • Good adhesion, up to 480kgf/cm2
  • After Heat aging at 150C, 11days adhesion 559kgf/cm2
  • Pass 2000 hours damp heat at 85°C/ 85% RH
  • Pass 1000cycles thermal shock at -40°C to 85°C
  • Pass 1000cycles thermal cycling at 85°C, 20°C/min ramp, 10mins soak
  • Suitable for ceramic, Kovar, Aluminium, PC, glass, ultem, stainless steel, ultem and PCB
  • Pass PCT 121°C, 100%RH, 2 atm, 48hrs
Translucent White

365nm

2000mW/cm2, 15s

or

+
80°C, 120mins or

120°C, 60mins

7,913 6 111

UV254-2

  • Slight Flowable, 40mm
  • Shadow Curable adhesive with opaque substrates
  • Suitable to use for die attach, bonding and active alignment applications
  • Low CTE
  • Good adhesion, up to 460kgf/cm2
  • After Heat aging at 150C, 11days adhesion 559kgf/cm2
  • Pass 2000 hours damp heat at 85°C/ 85% RH
  • Pass 1000cycles thermal shock at -40°C to 85°C
  • Pass 1000cycles thermal cycling at 85°C, 20°C/min ramp, 10mins soak
  • Suitable for ceramic, Kovar, Aluminium, PC, glass, ultem, stainless steel, ultem and PCB
  • Pass PCT 120°C, 48hrs

Translucent

White

365nm

2000mW/cm2, 15s

or

320-380nm

2000mW/cm2, 5s

+
80°C, 120mins or

120°C, 60mins

or

For Heat Cure only

80°C-130C, 120mins or above

14,620 6 96

UV777-11

  • Non flowable adhesive
  • UV LED 365nm and visible light 380-500nm curable
  • High Tg >150C
  • Low CTE
  • Suitable to use for sealing, bonding and active alignment applications
  • Good adhesion up to 80kgf/cm2
  • Pass 2000 hours damp heat at 85°C/ 85% RH
  • Pass 1000cycles thermal shock at -40°C to 85°C
  • Pass 1000cycles thermal cycling at 85°C, 20°C/min ramp, 10mins soak
  • Suitable for ceramic, Kovar, Aluminium, PC, glass, ultem, stainless steel and PCB
  • Pass PCT 121°C, 100%RH, 2 atm, 48hrs
Yellowish Paste

365nm

2000mW/cm2, 5s

or

380-500nm

>500mW/cm2,5s

+
110-120°C, 60mins

111,000 7 152

UV777-12

  • Slight flowable, 4mm
  • UV LED 365nm and visible light 380-500nm curable
  • Shadow Curable adhesive with opaque substrates
  • Suitable to use for die attach, bonding and active alignment applications
  • Low Modulus version than UV777-11
  • High Tg
  • Good adhesion, up to 100kgf/cm2
  • Pass 2000 hours damp heat at 85°C/ 85% RH
  • Pass 1000cycles thermal shock at -40°C to 85°C
  • Pass 1000cycles thermal cycling at 85°C, 20°C/min ramp, 10mins soak
  • Suitable for ceramic, kovar, aluminium, PC, glass, ultem, stainless steel, ultem and PCB
  • Pass PCT 121°C, 100%RH, 2 atm, 48hrs
Yellowish Paste

365nm

2000mW/cm2, 5s

 

Or

 

380-500nm

>500mW/cm2,5s

+


110-120°C, 60mins

32,750 5 154

UV788-2

  • Flowable <30mm
  • Low thermally conductivity <1W/mk
  • Suitable to use for bonding and active alignment including PLC, WMD and optical component applications
  • Low CTE
  • High Tg
  • Comply with NASA Outgassing requirement
  • Low Vapor Transmission rate at MSL85°C/85RH/24hrs
  • Good Relative permittivity from 30MHz to 1GHz
  • Good adhesion, up to 180kgf/cm2
  • Pass 3000 hours damp heat at 85°C/ 85% RH
  • Pass 1000cycles thermal shock at -40°C to 85°C
  • Pass 1000cycles thermal cycling at 85°C, 20°C/min ramp, 10mins soak
  • Suitable for glass and stainless-steel substrate bonding
  • Pass PCT 121°C, 100%RH, 2 atm, 48hrs
Translucent White

365nm

500-2000mW/cm2, 5s

+

100-110°C, 60mins

22,800 6 140

UV788-HV

  • Hardly flow
  • High viscosity version of UV788-2
  • Low thermally conductivity <1W/mk
  • Suitable to use for bonding and active alignment including PLC, WMD and optical component applications
  • Low CTE
  • High Tg
  • Comply with NASA Outgassing requirement
  • Low vapor transmission rate at MSL85°C/85RH/24hrs
  • Good Relative permittivity from 30MHz to 1GHz
  • Good adhesion up to 150kgf/cm2
  • Pass 3000 hours damp heat at 85°C/ 85% RH
  • Pass 1000cycles thermal shock at -40°C to 85°C
  • Pass 1000cycles thermal cycling at 85°C, 20°C/min ramp, 10mins soak
  • Suitable for ceramic, aluminium, PC, glass, ultem, stainless steel and PCB
  • Pass PCT 121°C, 100%RH, 2 atm, 48hrs
Translucent White

365nm

500-2000mW/cm2, 5s

+

100-110°C, 60mins

66,375 6 120

UV788-HT

  • Slight flowable 45mm
  • High Tg version of UV788-2
  • Low thermally conductivity <1W/mk
  • Suitable to use for bonding and active alignment including PLC, WMD and optical component applications
  • Low CTE
  • Extremely high Tg >200C
  • Low linear shrinkage
  • Comply with NASA Outgassing requirement
  • Low Vapor Transmission rate at MSL85°C/85RH/24hrs
  • Good relative permittivity from 30MHz to 1GHz
  • Good adhesion up to 150kgf/cm2
  • Pass 3000 hours damp heat at 85°C/ 85% RH
  • Pass 1000cycles thermal shock at -40°C to 85°C
  • Pass 1000cycles thermal cycling at 85°C, 20°C/min ramp, 10mins soak
  • Suitable for ceramic, Kovar, aluminium, PC, glass, ultem, stainless steel, gold, nickel and PCB
  • Pass PCT 121°C, 100%RH, 2 atm, 48hrs
  • Able to resist reflow at 260C for 30mins
Translucent White

365nm

500-2000mW/cm2, 15s

+

100-110°C, 60mins

28,870 6 203

UV788-2KN

  • Flowable, 45mm
  • Strongest adhesion to kovar, nickel and gold version of UV788-2
  • Low thermally conductivity <1W/mk
  • Suitable to use for bonding and active alignment including PLC, WMD and optical component applications
  • Low CTE
  • High Tg >200C
  • Low linear shrinkage
  • Comply with NASA Outgassing requirement
  • Low Vapor Transmission rate at MSL85°C/85RH/24hrs
  • Good Relative permittivity from 30MHz to 1GHz
  • Good adhesion, up to 190kgf/cm2
  • Pass 3000 hours damp heat at 85°C/ 85% RH
  • Pass 1000cycles thermal shock at -40°C to 85°C
  • Pass 1000cycles thermal cycling at 85°C, 20°C/min ramp, 10mins soak
  • Suitable for ceramic, Kovar, aluminium, PC, glass, ultem, stainless steel, gold, nickel and PCB
  • Pass PCT 121°C, 100%RH, 2 atm, 48hrs
Translucent White

365nm

500-2000mW/cm2, 15s

+

100-110°C, 60mins

19,200 6 134

UV788-2SB

  • Non fllowable version of UV788-2
  • Low thermally conductivity <1W/mk
  • Suitable to use for structural bonding and active alignment including PLC, WMD and optical component applications
  • Low CTE
  • High Tg >200C
  • Low linear shrinkage
  • Comply with NASA Outgassing requirement
  • Low Vapor Transmission rate at MSL85°C/85RH/24hrs
  • Good Relative permittivity from 30MHz to 1GHz
  • Good adhesion, up to 190kgf/cm2
  • Pass 3000 hours damp heat at 85°C/ 85% RH
  • Pass 1000cycles thermal shock at -40°C to 85°C
  • Pass 1000cycles thermal cycling at 85°C, 20°C/min ramp, 10mins soak
  • Suitable for ceramic, Kovar, aluminium, PC, glass, ultem, stainless steel, gold, nickel and PCB.
  • Pass PCT 121°C, 100%RH, 2 atm, 48hrs
  • Able to resist 260C for 30mins
Translucent White   28,340 6 136

UV788-2MR

  • Flowable, 49mm
  • Strongest moisture resistance version of UV788-2
  • Low thermally conductivity <1W/mk
  • Suitable to use for bonding and active alignment including PLC, WMD, optical component applications
  • Low CTE
  • High Tg >200C
  • Low linear shrinkage
  • Comply with NASA Outgassing requirement
  • Low Vapor Transmission rate at MSL85°C/85RH/24hrs
  • Good Relative permittivity from 30MHz to 1GHz
  • Good adhesion, up to 240kgf/cm2
  • Pass 3000 hours damp heat at 85°C/ 85% RH
  • Pass 1000cycles thermal shock at -40°C to 85°C
  • Pass 1000cycles thermal cycling at 85°C, 20°C/min ramp, 10mins soak
  • Suitable for ceramic, Kovar, aluminium, PC, glass, ultem, stainless steel, gold, nickel and PCB
  • Pass PCT 121°C, 100%RH, 2 atm, 48hrs
  • Able to resist 260C for 30mins
Translucent White

365nm

500-2000mW/cm2, 15s

+

100-110°C, 60mins

17,138 6 150

UV777-9

  • Flowable for RI matching
  • Low thermally conductivity <1W/mk
  • Suitable to use for bonding optical glass component
  • Low CTE
  • High Tg >200C
  • Low linear shrinkage
  • Comply with NASA Outgassing requirement
  • Low Vapor Transmission rate at MSL85°C/85RH/24hrs
  • Good Relative permittivity from 30MHz to 1GHz
  • Good adhesion, up to 400kgf/cm2
  • Pass 3000 hours damp heat at 85°C/ 85% RH
  • Pass 1000cycles thermal shock at -40°C to 85°C
  • Pass 1000cycles thermal cycling at 85°C, 20°C/min ramp, 10mins soak
  • Suitable for ceramic, Kovar, aluminium, alumina, PC, glass, ultem, nylon, stainless steel, gold, nickel and PCB
  • Pass PCT 121°C, 100%RH, 2 atm, 48hrs
  • Able to resist 260C for 30mins
Translucent White

365nm

2000mW/cm2, 15s

+

100-110°C, 60mins

300,000

6 52

UV782-1

  • Clear and Transparent
  • Flowable
  • High RI
  • Optical transmittance from 450-1100nm >80%
  • Suitable to use for RI matching and bonding of optical light path components
  • Good adhesion, up to 110kg/cm2 and 153kgf/cm2 with CT515-1 primer
  • Pass 3000 hours damp heat at 85°C/ 85% RH
  • Pass 1000cycles thermal shock at -40°C to 85°C
  • Pass 1000cycles thermal cycling at 85°C, 20°C/min ramp, 10mins soak
  • Suitable for ceramic, alumina, nickel, kovar, aluminium, glass, ultem, nylon, stainless steel, gold and PCB
  • Pass PCT 121°C, 100%RH, 2atm, 48hrs
  • Able to resist 260C for 30mins
  • UV+ Heat Curable, high Tg, good reliability, low outgassing, dissipating heat and low outgassing. Suitable for chip bonding.
  • Can cure under UV shadow condition
1.603 2000mW/cm2, 3-15s 860 6 107

UV775-4

  • Clear and transparent
  • Slight flowable high viscosity
  • Mid RI
  • CTE 50rpm
  • Optical transmittance from 450-600nm >86%
  • Suitable to use for RI matching and bonding of optical light path components
  • Good adhesion, up to 120kg/cm2.
  • Pass 3000 hours damp heat at 85°C/ 85% RH
  • Pass 1000cycles thermal shock at -40°C to 85°C
  • Pass 1000cycles thermal cycling at 85°C, 20°C/min ramp, 10mins soak
  • Suitable for ceramic, alumina, nickel, kovar, aluminium, glass, ultem, nylon, stainless steel, gold and PCB
  • Pass PCT 121°C, 100%RH, 2atm, 48hrs
  • Able to resist 260C for 30mins
  • Good resistance to 150C for 72hrs and UV aging
1.529

320nm -380nm, 100mW, 60s

+
120-150°C, 60mins

10,875 6 143

UV254

  • Clear and transparent
  • Flowable
  • Curable with UV or/and heat
  • High Tg
  • Mid RI
  • Optical transmittance from 450-940nm >84%
  • Suitable to use for RI matching and bonding of optical light path components
  • Good adhesion, up to 423kg/cm2.
  • Pass 3000 hours damp heat at 85°C/ 85% RH
  • Pass 1000cycles thermal shock at -40°C to 85°C
  • Pass 1000cycles thermal cycling at 85°C, 20°C/min ramp, 10mins soak
  • Suitable for Ceramic, Alumina, Nickel, Kovar, aluminium, glass, ultem, nylon, stainless steel, gold and PCB
  • Pass PCT 121°C, 100%RH, 2atm, 48hrs
  • Able to resist 260C for 30mins
  • Good resistance to 150C for 72hrs
1.51

365nm, 2W/cm2,15s

+
100-130°C, 60mins

481 6 165

UV773-11

  • Clear and transparent
  • Flowable
  • High RI
  • CTE 50rpm
  • Optical transmittance from 450-600nm >86%
  • Suitable to use for RI matching and bonding of optical light path components
  • Good adhesion, up to 304kg/cm2.
  • Pass 3000 hours damp heat at 85°C/ 85% RH
  • Pass 1000cycles thermal shock at -40°C to 85°C
  • Pass 1000cycles thermal cycling at 85°C, 20°C/min ramp, 10mins soak
  • Suitable for Ceramic, Alumina, Nickel, Kovar, aluminium, glass, ultem, nylon, stainless steel, gold and PCB
  • Pass PCT 121°C, 100%RH, 2atm, 48hrs
  • Able to resist 260C for 30mins
  • Good resistance to 150C for 72hrs
1.506

365nm, 2W/cm2,15s

+
100-130°C, 60mins

430 6 168

UV773-9

  • Clear and transparent
  • Flowable
  • High RI
  • Moderate CTE
  • Optical transmittance from 450-600nm >86%
  • Suitable to use for RI matching and bonding of optical light path components
  • Good adhesion, up to 242kg/cm2.
  • Pass 3000 hours damp heat at 85°C/ 85% RH
  • Pass 1000cycles thermal shock at -40°C to 85°C
  • Pass 1000cycles thermal cycling at 85°C, 20°C/min ramp, 10mins soak
  • Suitable for Ceramic, Alumina, Nickel, Kovar, aluminium, glass, ultem, nylon, stainless steel, gold and PCB
  • Pass PCT 121°C, 100%RH, 2atm, 48hrs
  • Able to resist 260C for 30mins
1.494

365nm, 2W/cm2,15s

+
100-130°C, 60-160mins

2,600 6 103

UV784-14

  • Clear and transparent
  • Flowable
  • High flexibility
  • Low Modulus
  • Mid RI
  • Optical transmittance from 450-1000nm >80%
  • Suitable to use for RI matching and bonding of optical light path components
  • Good adhesion, up to 201kg/cm2.
  • Pass 3000 hours damp heat at 85°C/ 85% RH
  • Pass 1000cycles thermal shock at -40°C to 85°C
  • Pass 1000cycles thermal cycling at 85°C, 20°C/min ramp, 10mins soak
  • Suitable for ceramic, alumina, nickel, kovar, aluminium, glass, Ultem, nylon, stainless steel, gold and PCB
  • Pass PCT 121°C, 100%RH, 2atm, 168hrs
1.493

365nm, 2W/cm2,15s or

180mW/cm2, 60s

+
100-120°C, 60mins

3,600 6 34

UV781-3

  • Clear and transparent
  • Flowable
  • Low RI
  • Low modulus
  • Optical transmittance from 450-1600nm >86%
  • Suitable to use for RI matching and bonding of optical light path components
  • Good adhesion, up to 62kg/cm2.
  • Pass 2000 hours damp heat at 85°C/ 85% RH
  • Pass 1000cycles thermal shock at -40°C to 85°C
  • Pass 1000cycles thermal cycling at 85°C, 20°C/min ramp, 10mins soak
  • Suitable for glass, stainless steel, Nickel and PCB.
  • Pass PCT 121°C, 100%RH, 2atm, 24hrs
  • Able to resist 260C for 45mins
1.413

365nm, 2W/cm2,15s

+
150°C, 120-200mins

4,076 6 57

OP993-11

  • Silicone soft gel
  • Clear translucent
  • Flowable
  • Low RI
  • Ultra-low outgassing
  • High Flexibility
  • Optical transmittance at 1100nm >98%
  • Suitable to use for RI matching, bonding of optical light path components and gap filling.
  • Pass 2000 hours damp heat at 85°C/ 85% RH
  • Pass 1000cycles thermal shock at -40°C to 85°C
  • Pass 1000cycles thermal cycling at 85°C, 20°C/min ramp, 10mins soak
  • Suitable for glass, stainless steel, nickel and PCB.
  • Able to resist 260C for 45mins
  • Able to resist operation up to 300°C and -60C
1.429

100°C, 120mins

or

150°C,30mins

3,942 6 -97

EN893-2

  • Silicone soft gel
  • Clear translucent
  • Slight flowable
  • Low RI
  • Ultra-low outgassing
  • High flexibility
  • Optical transmittance at 850nm >98%
  • Suitable to use for RI matching, bonding of optical light path components, gap filling and small component encapsulation to wire protection
  • Pass 2000 hours damp heat at 85°C/ 85% RH
  • Pass 1000cycles thermal shock at -40°C to 85°C
  • Pass 1000cycles thermal cycling at 85°C, 20°C/min ramp, 10mins soak
  • Suitable for glass, stainless steel, nickel and PCB
  • Able to resist 260C for 45mins
  • Able to resist operation up to 300°C and -60C
1.429

100°C, 120mins

or

150°C,30mins

4,300 6 -98

OP993-3

  • Silicone soft gel
  • Clear translucent
  • Able to retain shape after dispense
  • Low RI
  • Low outgassing
  • High flexibility
  • Optical transmittance from 450-1600nm >90%
  • Suitable to use for RI matching, bonding of optical light path components and small component encapsulation. 
  • Pass 2000 hours damp heat at 85°C/ 85% RH
  • Pass 1000cycles thermal shock at -40°C to 85°C
  • Pass 1000cycles thermal cycling at 85°C, 20°C/min ramp, 10mins soak
  • Suitable for glass, stainless steel, nickel and PCB
  • Able to resist 260C for 45mins
  • Able to resist operation up to 300°C and -60C
1.430

100°C, 120mins

or

150°C,30mins

6,500 6 -117

OP993-13

  • Silicone soft gel
  • Clear translucent
  • Slight flowable
  • Low RI
  • Ultra-low outgassing
  • High flexibility
  • Optical transmittance at 1100nm >98%
  • Suitable to use for RI matching, bonding of optical light path components, gap filling, small component encapsulation to wire protection.
  • Pass 2000 hours damp heat at 85°C/ 85% RH
  • Pass 1000cycles thermal shock at -40°C to 85°C
  • Pass 1000cycles thermal cycling at 85°C, 20°C/min ramp, 10mins soak
  • Suitable for glass, stainless steel, nickel and PCB
  • Able to resist 260C for 45mins
  • Able to resist operation up to 300°C and -60C
1.433

100°C, 120mins

or

150°C,30mins

15,460 6 -95
 
 
 
 
 
 
EMI Shielding and Silver Epoxy.
Product Code
Special Features
Appearance
Cure (˚C/ Time)
 Viscosity
(cP)
Shelf Life
(month)

EM120-1

  • Silicone system
  • Good EMI shielding performance up to 80dbm at 200MHz to 39GHz per MIL-DTL-83528C standard.
  • Good compressible gasket
  • Low volume resistivity
  • Suitable to use for EMI shielding onto metal substrates for base stations, PDAs, PC Cards, radios, mobile phones, cast plastic enclosures, packaged electronic assemblies and optical modules up to 800GHz package
  • Good gasketing strength on nickel plated case
  • Pass 2000 hours damp heat at 85°C/ 85% RH
  • Pass 1000cycles thermal shock at -40°C to 85°C
  • Pass 1000cycles thermal cycling at 85°C, 20°C/min ramp, 10mins soak
Silver Paste

150°C,

120mins

5.5x106

12

EM120-3

  • Silicone system
  • Good EMI shielding performance up to 100dbm at 200MHz to 39GHz per MIL-DTL-83528C standard
  • Extremely long pot life
  • Good compressible gasket
  • Low volume resistivity
  • Suitable to use for EMI shielding onto metal substrates for base stations, PDAs, PC Cards, radios, mobile phones, cast plastic enclosures, packaged electronic assemblies and optical modules up to 800GHz package
  • Good gasketing strength on nickel plated case.
  • Pass 2000 hours damp heat at 85°C/ 85% RH
  • Pass 1000cycles thermal shock at -40°C to 85°C
  • Pass 1000cycles thermal cycling at 85°C, 20°C/min ramp, 10mins soak
Silver Paste

120-150°C,

120mins

1.3x106

12

EM120-4

  • Silicone system
  • Good EMI shielding performance up to 100dbm at 200MHz to 39GHz per MIL-DTL-83528C standard.
  • Extremely long pot life
  • Good compressible gasket
  • Low volume resistivity
  • Suitable to use for EMI shielding onto metal substrates for base stations, PDAs, PC Cards, radios, mobile phones, cast plastic enclosures, packaged electronic assemblies and optical modules up to 800GHz package
  • Good gasketing strength on nickel plated case
  • Pass 2000 hours damp heat at 85°C/ 85% RH
  • Pass 1000cycles thermal shock at -40°C to 85°C
  • Pass 1000cycles thermal cycling at 85°C, 20°C/min ramp, 10mins soak
Silver Paste

120-150°C,

120mins

1.25x106

12

AG824

  • Silver epoxy paste
  • Low viscosity conductive epoxy
  • Low volume resistivity
  • High thixotropic index
  • BLT <30um
  • Easily dispensable for high-speed dispensing
  • High Tg >150°C
  • Bond well on Gold, Nickel, Kovar, Stainless Steel, Aluminium PCB, Silicon, Glass and etc.
  • Suitable for chip bonding, die attach and conductive component bonding.
  • High adhesion strength up to 293kgf/cm2
  • Low shrinkage during cure
  • Good adhesion to ultem and PCB.
  • Pass 2000 hours damp heat at 85°C/ 85% RH
  • Pass 1000cycles thermal shock at -40°C to 85°C
  • Pass 1000cycles thermal cycling at 85°C
    20°C/min ramp, 10mins soak
  • Pass PCT 121°C, 100%RH, 2 atm, 24hrs
Silver Paste 150°C, 2hrs 7,000 6

AG824-1

  • Silver epoxy paste
  • Low viscosity conductive epoxy
  • Low volume resistivity
  • High thixotropic index
  • BLT >30um
  • Easily dispensable for high-speed dispensing
  • High Tg >150°C
  • Bond well on Gold, Nickel, Kovar, Stainless Steel, Aluminium PCB, Silicon, Glass and etc
  • Suitable for chip bonding, die attach and conductive component bonding
  • High adhesion strength up to 293kgf/cm2
  • Low shrinkage during cure
  • Good adhesion to ultem and PCB
  • Pass 2000 hours damp heat at 85°C/ 85% RH
  • Pass 1000cycles thermal shock at -40°C to 85°C
  • Pass 1000cycles thermal cycling at 85°C
    20°C/min ramp, 10mins soak
  • Pass PCT 121°C, 100%RH, 2 atm, 24hrs
Silver Paste 150°C, 2hrs 12,700 6

AG815-1

  • 2-part nano filler conductive epoxy.
  • Long pot life
  • Solvent-free and low volatiles during cure
  • Low shrinkage during cure
  • Rigid yet flexible
  • Specially developed for low stress to consumer electrical and electronic component bonding to potting
  • Good adhesion various metals and plastics
  • Pass 1000 hours damp heat at 85°C/ 85% RH
  • Pass 1000cycles thermal shock at -40°C to 85°C
  • Pass 1000cycles thermal cycling at 85°C
    20°C/min ramp, 10mins soak
  • Pass PCT 121°C, 100%RH, 2 atm, 24hrs
Black Fill

25°C, 24hrs

or

80°C, 2hrs

840 12